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    Chip packaging CoWoS facilities in Chiayi Science Park 結果共1筆

  • TSMC to build 2 advanced chip facilities in Chiayi
    Vice Premier Cheng Wen-tsan announces TSMC’s plan to build two cutting-edge chip packaging CoWoS facilities in Chiayi Science Park, with construction set to begin in May 2024. The project is expected to create around 3,000 job opportunities and boost the local economy.
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    2024/03/18 15:17
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